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US 10,762,326 B2Granted
Fingerprint identification device and manufacturing method thereof, and electronic device
AssigneeBoe Technology Group Co., Ltd.
InventorsWenxiu Zhu, Yanliu Sun
Life of this patent
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Abstract
A fingerprint identification device and manufacturing method thereof, and electronic device are disclosed. The fingerprint identification device includes a base film, a detection circuit, and an adhesive layer. The detection circuit is provided at a first side of the base film; the adhesive layer is provided on the first side of the base film, and is provided between the base film and the detection circuit, so as to adhere the detection circuit onto the base film.
Claims18
A fingerprint identification device, comprising:
- a base film;
- a detection circuit, which is provided at a first side of the base film;
- an adhesive layer, which is provided on the first side of the base film and is provided between the base film and the detection circuit, so as to adhere the detection circuit onto the base film;
- and
- a refractive index matching film, which is provided on the first side of the base film and provided between the base film and the adhesive layer,
- wherein the refractive index matching film has a first refractive index, the adhesive layer has a second refractive index, and the first refractive index is larger than the second refractive index;
- the refractive index matching film is in direct contact with the adhesive layer;
- the fingerprint identification device further comprises a display array layer,
- the display array layer and the detection circuit are superposed;
- the display array layer is provided at a side, which is closer to the adhesive layer, of the detection circuit;
- the display array layer is provided at a second side of the base film,
- wherein the second side of the base film is opposite to the first side of the base film,
- the display array layer comprises a plurality of sub-pixels, which are arrayed, and the display array layer further comprises at least one opening provided between adjacent sub-pixels, and
- an orthographic projection of the opening on the detection circuit and the detection circuit at least partially overlap with each other.
11 more elements
A manufacturing method for a fingerprint identification device, comprising:
- providing a base film;
- forming an adhesive layer on a first side of the base film;
- and
- providing a detection circuit at a side, which is away from the base film, of the adhesive layer, so as to allow the adhesive layer to adhere the detection circuit onto the first side of the base film,
- wherein before forming the adhesive layer on the first side of the base film, the method further comprises:
- forming a refractive index matching film on the first side of the base film, wherein the adhesive layer is formed on a side, which is away from the base film, of the refractive index matching film, so as to form the adhesive layer on the first side of the base film;
- the refractive index matching film has a first refractive index, the adhesive layer has a second refractive index, and the first refractive index is larger than the second refractive index;
- the refractive index matching film is in direct contact with the adhesive layer;
- the fingerprint identification device further comprises a display array layer,
- the display array layer and the detection circuit are superposed;
- the display array layer is provided at a side, which is closer to the adhesive layer, of the detection circuit;
- the display array layer is provided at a second side of the base film,
- wherein the second side of the base film is opposite to the first side of the base film,
- the display array layer comprises a plurality of sub-pixels, which are arrayed, and the display array layer further comprises at least one opening provided between adjacent sub-pixels, and
- an orthographic projection of the opening on the detection circuit and the detection circuit at least partially overlap with each other.
12 more elements
Dependencies are inferred from the claim text.