Fingerprint sensor and manufacturing method thereof

A manufacturing method of a fingerprint sensor, comprising:

• providing a redistribution structure;
• forming a die and a plurality of conductive structures over the redistribution structure, wherein the die comprises a plurality of connection pads;
• encapsulating the die and the plurality of conductive structures by an encapsulant;
• forming a first dielectric layer over the die, the encapsulant, and the plurality of conductive structures, wherein the first dielectric layer comprises a plurality of openings exposing at least a portion of the plurality of connection pads and at least a portion of the plurality of conductive structures;
• forming a seed layer in the plurality of openings;
• forming a conductive material layer over the seed layer;
• planarizing the conductive material layer, the seed layer, and the first dielectric layer to form a plurality of conductive patterns surrounded by the first dielectric layer, wherein top surfaces of the plurality of conductive patterns are coplanar with a top surface of the first dielectric layer;
• and
• forming a second dielectric layer to cover the top surface of the first dielectric layer and the top surfaces of the plurality of conductive patterns.

A manufacturing method of a fingerprint sensor, comprising:

• providing a redistribution structure;
• forming a die and a plurality of conductive structures over the redistribution structure, wherein the die comprises a plurality of connection pads;
• encapsulating the die and the plurality of conductive structures by an encapsulant;
• forming a first dielectric layer over the die, the encapsulant, and the plurality of conductive structures, wherein the first dielectric layer comprises a plurality of openings exposing at least a portion of the plurality of connection pads and at least a portion of the plurality of conductive structures;
• filling a conductive paste into the plurality of openings;
• curing the conductive paste, wherein a top surface of the cured conductive paste has a wavy profile;
• planarizing the cured conductive paste to form a plurality of conductive patterns, wherein top surfaces of the plurality of conductive patterns are coplanar with a top surface of the first dielectric layer;
• and
• forming a second dielectric layer to cover the top surface of the first dielectric layer and the top surfaces of the plurality of conductive patterns.