Projection exposure method and projection exposure apparatus for microlithography
AssigneeCarl Zeiss SMT GmbH
InventorAlexander Wolf
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Abstract
A projection exposure method and apparatus are disclosed for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask under the control of an operating control system of a projection exposure apparatus, part of the pattern lying in an illumination region is imaged onto the image field on the substrate with the aid of a projection lens, wherein all rays of the projection radiation contributing to the image generation in the image field form a projection beam path.
Claims20
A method of using a projection exposure apparatus comprising an illumination system and a projection lens, the method comprising:
- using the illumination system to illuminate a region of a pattern of a mask with illumination radiation, wherein the mask is in a region of an object plane of the projection lens;
- using the projection lens to project part of the pattern of the mask in the region onto a substrate in an image field of the projection lens with projection radiation, wherein all rays of the projection radiation contributing to image generation in the image field form a projection beam path;
- and
- actuating a manipulator to influence a wavefront of the projection radiation, wherein the manipulator comprises a manipulator surface arranged in the projection beam path and an actuating device for reversibly changing an optical effect of the manipulator surface,
- wherein:
- manipulated value changes of the actuating device are determined by an operating control system on the basis of a control program with a correction algorithm which optimizes a target function;
- and
- the target function for at least one manipulator comprises a telecentricity sensitivity describing a relationship between a defined manipulated value change at the manipulator and an effect achievable thereby on the telecentricity of the projection radiation in the image field.
A projection exposure apparatus for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask, comprising:
- an illumination system configured to receive primary radiation of a primary radiation source and to generate an illumination radiation directed onto a pattern of an object in an illumination region;
- a projection lens configured to project a part of the pattern that lies in the illumination region onto an image field at a substrate with projection radiation;
- an operating control system configured to control the operation of the projection exposure apparatus;
- and
- a wavefront manipulation system configured to dynamically influence the wavefront of the projection radiation travelling from the object plane to the image plane,
- wherein:
- the wavefront manipulation system comprises a manipulator which is actuatable via control signals of the operating control system;
- the manipulator comprises a manipulator surface in the projection beam path and an actuating device configured to reversibly change an optical effect of the manipulator surface;
- telecentricity sensitivities of manipulators for varying the telecentricity are storable in a memory of the operating control system;
- a telecentricity sensitivity describes a relationship between a defined manipulated value change at a manipulator and an effect achieved thereby on the telecentricity of the projection lens;
- and
- the operating control system is configured so that operation of the projection exposure apparatus is controllable taking account of the telecentricity sensitivities.
A projection lens, comprising:
- a multiplicity of optical elements with optical surfaces are arranged in a projection beam path between an object plane and an image plane so that a pattern in the object plane is imageable in the image plane via the optical elements;
- and
- a wavefront manipulation system configured to dynamically influence a wavefront of projection radiation travelling from the object plane to the image plane,
- wherein:
- the projection lens comprises a dedicated telecentricity manipulator;
- the dedicated telecentricity manipulator comprises a first manipulator element and a second manipulator element separate from the first manipulator element;
- the first manipulator element is in the projection beam path in or optically near a first field plane;
- the second manipulator element is arranged in the projection beam path in or optically near a second field plane optically conjugate to the first field plane;
- the projection lens comprises an imaging lens part having a magnifying or reducing imaging scale arranged between the first field plane and the second field plane;
- and
- the projection lens comprises an actuating device assigned to the first and second manipulator elements configured to bring about a relative change of the first and second manipulator elements with respect to one another in such a way that one of the manipulator elements brings about a change in telecentricity, distortion and defocus and the other manipulator element partly or completely compensates for the caused change in distortion and defocus.
Dependencies are inferred from the claim text.