Pattern forming method, method for manufacturing electronic device, and laminate
AssigneeFUJIFILM Corporation
InventorsHideaki Tsubaki, Wataru Nihashi, Toru Tsuchihashi, Kei Yamamoto
Life of this patent
Estimating the term…
Loading patent…
AssigneeFUJIFILM Corporation
InventorsHideaki Tsubaki, Wataru Nihashi, Toru Tsuchihashi, Kei Yamamoto
Estimating the term…
The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.
A pattern forming method comprising:
A laminate comprising:
Dependencies are inferred from the claim text.