Module with transmit and receive optical subassemblies with specific pic cooling architecture
AssigneeRockley Photonics Limited
InventorsGerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
Life of this patent
Estimating the term…
Abstract
An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.
Claims12
A transceiver assembly, comprising:
- a housing;
- an optical subassembly;
- and
- a host board comprising a printed circuit board,
- the optical subassembly comprising:
- a fiber,
- a photonic integrated circuit,
- an analog electronic integrated circuit, and
- a single, monolithic, substantially planar subcarrier;
- and
- a thermoelectric cooler;
- the subcarrier having a thermal conductivity greater than 10 W/m/K;
- the photonic integrated circuit and the analog electronic integrated circuit being on the subcarrier;
- the thermoelectric cooler being between the subcarrier and only the photonic integrated circuit among the photonic integrated circuit and the analog electronic integrated circuit;
- the fiber being coupled to the photonic integrated circuit;
- the subcarrier being parallel to, secured to, and in thermal contact with, a first wall of the housing;
- the photonic integrated circuit being connected to the analog electronic integrated circuit;
- the optical subassembly having a plurality of contact pads for establishing electrical connections between the analog electronic integrated circuit and test equipment probes, the optical subassembly being configured to be separately testable by supplying power to the optical subassembly through one or more of the contact pads and sending data to and/or receiving data from the optical subassembly through one or more of the contact pads;
- and
- the host board being located substantially opposite the optical subassembly within the housing,
- wherein the transceiver assembly is a quad small form-factor pluggable package.
A method for manufacturing a module, the method comprising:
- assembling an optical subassembly comprising:
- a fiber,
- a photonic integrated circuit,
- an analog electronic integrated circuit,
- a single, monolithic substantially planar subcarrier, and
- a thermoelectric cooler,
- the photonic integrated circuit and the analog electronic integrated circuit being on the subcarrier,
- the thermoelectric cooler being between the subcarrier and only the photonic integrated circuit among the photonic integrated circuit and the analog electronic integrated circuit;
- testing the optical subassembly;
- determining that the testing of the optical subassembly was successful;
- and
- in response to determining that the testing of the optical subassembly was successful:
- installing, in a housing:
- the optical subassembly, and
- a host board comprising a printed circuit board,
- with:
- the subcarrier being parallel to, secured to, and in thermal contact with, a first wall of the housing, and
- the host board being located substantially opposite the optical subassembly within the housing,
- wherein the module is a quad small form-factor pluggable package.
Dependencies are inferred from the claim text.