Systems and methods for improved detector assembly sizing

A detector assembly including:

• a semiconductor detector having a first surface and a second surface opposed to each other, the first surface comprising pixelated anodes, and the second surface comprising a cathode electrode;
• a collimator including openings defined by septa, the collimator defining a pitch D between adjacent septa, the septa defining a septa length L;
• and
• a processing unit configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector, wherein each pixel comprises a plurality of corresponding virtual sub-pixels, wherein absorbed photons are counted as events in a corresponding virtual sub-pixel, wherein the virtual sub-pixels define a sub-pixel pitch d, wherein a ratio of L/d is 25 or more.

A method including:

• providing a semiconductor detector having a first surface and a second surface opposed to each other, the first surface comprising pixelated anodes, and the second surface comprising a cathode electrode;
• disposing a collimator proximate the semiconductor detector, the collimator including openings defined by septa, the collimator defining a pitch D between adjacent septa, the septa defining a septa length L, wherein a ratio of L/D is less than 14;
• and
• coupling a processing unit to the semiconductor detector, the processing unit configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector, wherein each pixel comprises a plurality of corresponding virtual sub-pixels, wherein absorbed photons are counted as events in a corresponding virtual sub-pixel.