Method and system for optical metrology in patterned structures
AssigneeNova Measuring Instruments Ltd.
InventorsBoris Levant, Yanir Hainick, Vladimir Machavariani, Roy Koret, Gilad Barak
Life of this patent
Estimating the term…
Loading patent…
AssigneeNova Measuring Instruments Ltd.
InventorsBoris Levant, Yanir Hainick, Vladimir Machavariani, Roy Koret, Gilad Barak
Estimating the term…
Determining parameters of a patterned structure located on top of an underneath layered structure, where input data is provided which includes first measured data PMD being a function ƒ of spectral intensity Iλ and phase ϕ, PMD=ƒ(Iλ; ϕ), corresponding to a complex spectral response of the underneath layered structure, and second measured data Smeas indicative of specular reflection spectral response of a sample formed by the patterned structure and the underneath layered structure, and where a general function F is also provided describing a relation between a theoretical optical response Stheor of the sample and a modeled optical response Smodel of the patterned structure and the complex spectral response PMD of the underneath layered structure, such that Stheor=F(Smodel; PMD), where the general function is then utilized for comparing the second measured data Smeas and the theoretical optical response Stheor, and determining parameter(s) of interest of the top structure.
An optical metrology method for use in determining one or more parameters of a patterned upper structure located on top of an underneath layered structure on a semiconductor wafer, the method being carried out by a computer system comprising a processor and a memory, the method comprising:
An optical metrology system for use in determining one or more parameters of a patterned upper structure located on top of an underneath layered structure on a semiconductor wafer, the system comprising:
Dependencies are inferred from the claim text.