# US 10,760,930 B2 · Sensor package, method of manufacturing the same, and method of manufacturing lid structure

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- Number: US 10,760,930 B2
- Document ID: US10760930B2
- Status: Granted
- Kind: B2
- Application number: 16/131,467
- Filed: 2018-09-14
- Published: 2019-06-20
- Granted: 2020-09-01
- Earliest claimed: 2017-12-20
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Samsung Electronics Co., Ltd.
- Inventors: Sungeun Jo; Youngshin Kwon; Minjin Kim; Woonbae Kim; Youngdoo Jung; Eunhee Jung; Inho Choi
- Web page: https://patentgrep.com/patent/US10760930B2

## CPC

- G01D 11/245: {Housings for sensors}
- G01N 33/0009: {General constructional details of gas analysers, e.g. portable test equipment (devices for withdrawing samples in the gaseous state G01N1/22)}
- H10W 70/655: Fan-out layouts
- H10W 90/752: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

## Claims

### Claim 1

A sensor package, comprising:
a package substrate;
a gas sensor on the package substrate;
a lid on the package substrate and positioned over the gas sensor, the lid having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate; and
a waterproof film in the hole of the lid,
wherein the waterproof film is formed on the first inner surface and the first outer surface of the lid.

### Claim 2 (depends on 1)

The sensor package of claim 1, wherein
the waterproof film further extends onto at least a portion of a second outer surface of the lid, and
the lid has an edge provided at a location where the first outer surface meets the second outer surface,
wherein the first outer surface of the lid corresponds to an upper surface of the lid, and
wherein the second outer surface of the lid corresponds to an outer sidewall of the lid.

### Claim 3 (depends on 2)

The sensor package of claim 2, wherein the second outer surface of the lid comprises:
a first sub-outer surface covered with the waterproof film; and
a second sub-outer surface exposed by the waterproof film and closer than the first sub-outer surface to the package substrate,
wherein the first sub-outer surface corresponds to an outer sidewall of an upper portion of lid, and
wherein the second sub-outer surface corresponds to an outer sidewall of a lower portion of the lid that connects the upper portion of the lid to the package substrate.

### Claim 4 (depends on 3)

The sensor package of claim 3, wherein the first sub-outer surface of the lid has a surface roughness greater than a surface roughness of the second sub-outer surface of the lid.

### Claim 5 (depends on 2)

The sensor package of claim 2, further comprising an adhesion portion in physical contact with a bottom surface of the waterproof film and with a second inner surface of the lid,
wherein the bottom surface of the waterproof film faces the package substrate,
wherein the second inner surface of the lid is opposite to the second outer surface of the lid, and
wherein the second outer surface of the lid faces away from the package substrate.

### Claim 6 (depends on 1)

The sensor package of claim 1,
wherein the waterproof film has at least one recess,
wherein the recess is provided on a top surface of the waterproof film.

### Claim 7 (depends on 6)

The sensor package of claim 6, wherein the recess exposes the first outer surface of the lid.

### Claim 8 (depends on 1)

The sensor package of claim 1, wherein the waterproof film comprises a hydrophobic polymer.

### Claim 9 (depends on 1)

The sensor package of claim 1, further comprising an adhesion film between the lid and the waterproof film.

### Claim 10 (depends on 1)

The sensor package of claim 1, wherein
the waterproof film has pores each having a diameter ranging from about 0.1 μm to about 10 μm, and
the waterproof film has a thickness ranging from about 10 μm to about 500 μm in the hole.

### Claim 11 (depends on 1)

The sensor package of claim 1, wherein the gas sensor comprises a gas sensor chip.