Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same

A curable composition for a printed circuit board, comprising:

• a block copolymer;
• a hydroxyl group-containing (meth)acrylate compound;
• a bifunctional (meth)acrylate compound comprising no hydroxyl group;
• and
• a photopolymerization initiator,
• wherein the curable composition has a viscosity of 5 to 50 mPa·s at 50° C. in the absence of a dilution solvent for adjusting the viscosity, the block copolymer is one of an X-Y-X block copolymer or an X-Y-X′ block copolymer, where X and X′ represent a polymer unit having a glass transition temperature Tg of 0° C. or higher, and Y represents a polymer unit having a glass transition temperature Tg of lower than 0° C., the block copolymer is in an amount of 1 to 30 parts by mass, the hydroxyl group-containing (meth)acrylate compound is in an amount of 5 to 50 parts by mass, the bifunctional (meth)acrylate compound is in an amount of 20 to 80 parts by mass, and the photopolymerization initiator is in an amount of 0.5 to 10 parts by mass with respect to 100 parts by mass of the curable composition.