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US 10,758,968 B2Granted
Mold surface treatment method and mold treated with said method
AssigneeFuji Manufacturing Co., Ltd.
InventorsKeiji Mase, Shozo Ishibashi, Yusuke Kondo
Life of this patent
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Abstract
A method of treating a surface of a mold. The method includes forming dimples on a surface of a mold by ejecting substantially spherical ejection-particles so as to bombard the surface of the mold. The dimples are formed so as to satisfy a condition defined by the following formula: 1+3.3e−H/230≤W≤3+13.4e−H/1060 wherein W is an equivalent diameter (μm) of the dimples and H is a base metal hardness (Hv) of the mold.
Claims4
A method of treating a surface of a mold comprising:
- forming dimples on a surface of a mold by ejecting substantially spherical ejection- particles so as to bombard the surface of the mold,
- the dimples being formed so as to satisfy a condition defined by the following formula:
- 1+3.3e−H/230≤W≤3+13.4e−H/1060 Formula (1)
- 0.01+0.2e−H/230≤D≤0.01+1.1e−H/500 Formula (2)
- wherein W is an equivalent diameter (μm) of the dimples, D is a depth (μm) of the dimples and H is a base metal hardness (Hv) of the mold.
2 more elements
Dependencies are inferred from the claim text.