Cooling technology for cryogenic link
AssigneeRambus Inc.
InventorsFrederick A. Ware, Carl W. Werner
Life of this patent
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Abstract
The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first cryogenic temperature domain and a second component located in a second cryogenic temperature domain that is lower in temperature than the first cryogenic temperature domain. An electrical conductor is coupled between the first component and the second component along a first plane. The electrical conductor carries a signal between the first component and the second component. A cooling assembly is coupled to a segment of the electrical conductor. The cooling assembly may include an electrical insulator including ceramic material. The cooling assembly may include a cold plate, two cold plates, or an orthogonal cold strip.
Claims19
An electronic system comprising:
- a first component configured to operate in a first temperature domain;
- a second component configured to store data in a second temperature domain, wherein the second temperature domain is lower in temperature than the first temperature domain;
- an electrical conductor coupled between the first component and the second component along a first plane, wherein the electrical conductor is to carry a signal between the first component and the second component;
- an electrical insulator coupled to a segment of the electrical conductor;
- and
- an orthogonal cold strip coupled to the electrical insulator, wherein a height of the orthogonal cold strip is orthogonal to a first plane in which the electrical conductor is disposed, and wherein a total height of the orthogonal cold strip and the electrical insulator is greater than a width of the orthogonal cold strip, wherein the first component is a controller and the second component is a memory.
An electronic system comprising:
- a memory subsystem configured to store data in a first cryogenic temperature domain;
- a processor configured to operate in a second cryogenic temperature domain that is lower in temperature than the first cryogenic temperature domain;
- a flex cable coupled between the memory subsystem and the processor, the flex cable comprising at least one link upon which a signal is carried, wherein a first segment of the at least one link is in a superconducting state in the second cryogenic temperature domain and a second segment of the at least one link is in a conducting state in the first cryogenic temperature domain;
- and
- a cooling assembly coupled to the flex cable, the cooling assembly to thermally clamp the flex cable to the second cryogenic temperature domain, wherein the cooling assembly comprises an electrical insulator comprising ceramic material, the electrical insulator coupled to the at least one link.
A cooling assembly comprising:
- an electrical insulator, the electrical insulator to couple to a segment of an electrical conductor that carries a signal between a first component configured to operate in a first temperature domain and a second component configured to store data in a second temperature domain, wherein the second temperature domain is lower in temperature than the first temperature domain, wherein the first component is a controller and the second component is a memory;
- and
- an orthogonal cold strip stacked on the electrical insulator, wherein a height of the orthogonal cold strip is orthogonal to a first plane in which the electrical conductor is disposed, and wherein a total height of the orthogonal cold strip and the electrical insulator is greater than a width of the orthogonal cold strip.
Dependencies are inferred from the claim text.