Method of forming a laminate structure having a plated through-hole using a removable cover layer

A core or sub-composite structure, comprising:

• a first conductive film including a peelable first cover layer formed on or coupled to a first surface of a first conductive layer, wherein the first cover layer is less than 20 microns thick;
• a dielectric layer coupled to a second surface of the first conductive layer of the first conductive film, wherein the first conductive layer is thinner than the dielectric layer;
• a hole formed through the first cover layer, the first conductive layer, and the dielectric layer;
• and
• a plating resist disposed in the hole, and over at least a portion of the first cover layer.