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US 10,757,815 B2Granted
Method for fabrication of a soft-matter printed circuit board
AssigneeCarnegie Mellon University
InventorsCarmel Majidi, Tong Lu, Eric J. Markvicka
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Abstract
A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.
Claims10
A soft-matter printed circuit board comprising:
- one or more solid state devices suspended in a layer of an elastomeric material such that a board-side of the devices is exposed;
- a layer of an anisotropically conductive substance comprising ferromagnetic microspheres coated with a liquid metal and suspended in a cured elastomeric substance covering the exposed board side of the devices;
- a layer of liquid metal disposed on the layer of an anisotropically conductive substance, the layer of liquid metal having a circuit pattern etched therein.
Dependencies are inferred from the claim text.