Embedded component package structure and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Fan Chen, Chien-Hao Wang
Life of this patent
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Abstract
A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
Claims26
An embedded component package structure, comprising:
- a first dielectric layer having a first surface;
- a component disposed on the first dielectric layer, wherein the first dielectric layer surrounds and covers a side of the component, and the first dielectric layer has a covering height greater than 3 μm relative to the first surface;
- a second dielectric layer disposed on the first dielectric layer and covering the component;
- and
- a patterned circuit layer disposed on the second dielectric layer, and the patterned circuit layer is electrically connected to the component,
- wherein the component is embedded between the first dielectric layer and the second dielectric layer, and
- wherein each of the first dielectric layer and the second dielectric directly contacts the side of the component.
An embedded component package structure, comprising:
- a first dielectric layer having a first surface;
- a component disposed on the first dielectric layer, wherein a protrusion of the first dielectric layer protrudes relative to the first surface of the first dielectric layer, and wherein each of the protrusion of the first dielectric layer and the first surface of the first dielectric layer is positioned between two opposite faces of the component in a direction perpendicular to the first surface of the first dielectric layer;
- a second dielectric layer disposed on the first dielectric layer and covering the component;
- and
- a patterned circuit layer disposed on the second dielectric layer, and the patterned circuit layer is electrically connected to the component.
An embedded component package structure, comprising:
- a first dielectric layer having a first surface;
- a component disposed on the first dielectric layer, wherein a protrusion of the first dielectric layer is positioned between the component and the first surface of the first dielectric layer, is shorter than the component in a direction perpendicular to the first surface of the first dielectric layer, and protrudes by a covering height greater than 5 μm relative to the first surface;
- a second dielectric layer disposed on the first dielectric layer and covering the component;
- and
- a patterned circuit layer disposed on the second dielectric layer, and the patterned circuit layer is electrically connected to the component.
Dependencies are inferred from the claim text.