Chip double-sided layout on PCB

A layout method of a printed circuit board, comprising:

• arranging a first processor chip on a first surface of the printed circuit board;
• arranging a second processor chip on a second surface of the printed circuit board;
• disposing a first through-hole on the printed circuit board, with part of pins of the first processor chip being connected to part of pins of the second processor chip via the first through-hole;
• arranging a third processor chip and a first bridge chip on the first surface of the printed circuit board;
• connecting the third processor chip to the first processor chip via the first bridge chip and to the second processor chip via the first processor chip;
• arranging a fourth processor chip and a second bridge chip on the second surface of the printed circuit board;
• disposing a second through-hole on the printed circuit board, part of pins of the third processor chip being connected to part of pins of the fourth processor chip via the second through-hole;
• connecting the fourth processor chip to the second processor chip via the second bridge chip and to the first processor chip via the second processor chip.

An electronic equipment device, comprising:

• a printed circuit board;
• and
• a first processor chip, a second processor chip, a third processor chip, a fourth processor chip, a first bridge chip, and a second bridge chip arranged on the printed circuit board, wherein:
• the first processor chip is arranged on a first surface of the printed circuit board;
• the second processor chip is arranged on a second surface of the printed circuit board;
• a first through-hole is disposed on the printed circuit board, with part of pins of the first processor chip being connected to part of pins of the second processor chip via the first through-hole;
• the third processor chip and the first bridge chip are arranged on the first surface of the printed circuit board;
• the third processor chip is connected to the first processor chip via the first bridge chip and connected to the second processor chip via the first processor chip;
• the fourth processor chip and the second bridge chip are arranged on the second surface of the printed circuit board;
• a second through-hole is disposed on the printed circuit board, part of pins of the third processor chip being connected to part of pins of the fourth processor chip via the second through-hole;
• the fourth processor chip is connected to the second processor chip via the second bridge chip and connected to the first processor chip via the second processor chip.