Higher density multi-component and serial packages
AssigneeKemet Electronics Corporation
InventorsJames A. Burk, John Bultitude, Galen W. Miller
Life of this patent
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Abstract
A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.
Claims30
A method for forming a high density multi-component package comprising:
- providing at least two electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
- forming a stack of adjacent said electronic components;
- attaching adjacent said first external terminations with a first adhesive there between;
- attaching adjacent said second external terminations with a second adhesive there between wherein said second adhesive is a high temperature insulating adhesive;
- and
- wherein said adjacent electronic components are connected serially.
A method for forming a high density multi-component package comprising:
- providing at least three electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
- forming a stack of adjacent said electronic components;
- attaching a pair of adjacent said first external terminations with a first adhesive there between wherein said first adhesive is a high temperature conductive adhesive;
- attaching a pair of adjacent said second external terminations with a second adhesive there between wherein said second adhesive is a high temperature insulating adhesive;
- and
- wherein said adjacent electronic components are connected serially.
Dependencies are inferred from the claim text.