High density multi-component packages
AssigneeKemet Electronics Corporation
InventorsJohn Bultitude, Galen Miller, John E. McConnell
Life of this patent
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Abstract
Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.
Claims60
A method for forming a high density multi-component package comprising:
- providing at least two electronic components wherein each electronic component comprises a first external termination and a second external termination;
- forming a stack of said electronic components with at least one interposer, each interposer of said at least one interposer between respective adjacent electronic components wherein each interposer of said at least one interposer is independently selected from an active interposer and a mechanical interposer;
- wherein an active interposer comprises active pads, mechanical pads, and a substrate, each active pad is in electrical contact with a corresponding active pad on an opposite side of the substrate, each mechanical pad is not in electrical contact with a corresponding mechanical pad on the opposite side of the substrate, wherein for at least one of said respective adjacent electronic components, the first external termination is electrically connected by an interconnect to one of said two of said active pads opposing each other on the substrate, and the second external termination is in contact with and adhered by the interconnect to a respective one of two of said mechanical pads but not electrically connected to the other of said two mechanical pads, said two mechanical pads opposing each other on the substrate, and
- wherein a mechanical interposer comprises a substrate and mechanical pads and does not have an active pad,
- wherein said respective adjacent electronic components are connected serially.
A method for forming an electronic circuit comprising:
- forming a high density multi-component package by:
- providing at least two electronic components wherein each electronic component comprises a first external termination and a second external termination;
- forming a stack of said electronic components with an interposer between a first electronic component of said electronic components and a second electronic component of said electronic components wherein said interposer is independently selected from an active interposer and a mechanical interposer;
- wherein an active interposer comprises active pads, mechanical pads, and a substrate, each active pad is in electrical contact with a corresponding active pad on an opposite side of the substrate, each mechanical pad is not in electrical contact with a corresponding mechanical pad on the opposite side of the substrate, wherein for said first electronic component, the first external termination is electrically connected by an interconnect to one of said two of said active pads opposing each other on the substrate, and the second external termination is in contact with an adhered by the interconnect to a respective one of two of said mechanical pads but not electrically connected to the other of said two mechanical pads, said two mechanical pads opposing each other on the substrate, and
- wherein a mechanical interposer comprises a substrate and mechanical pads and does not have an active pad,
- wherein said first and second electronic components are connected serially;
- providing a circuit board comprising traces wherein at least one trace of said traces is an active trace and at least one trace of said traces is a mechanical trace;
- attaching at least one said first external termination of said first electronic component to one trace of said active traces with said interconnect;
- and
- attaching at least one said second external termination of said second electronic component to one trace of said mechanical traces with said interconnect.
Dependencies are inferred from the claim text.