Printed wiring board and method for manufacturing printed wiring board

A printed wiring board comprising:

• a main substrate having a top surface, a bottom surface, a slit penetrating from the top surface to the bottom surface, and a plurality of first electrodes provided on the bottom surface;
• and
• a rising substrate having a support portion and a plurality of second electrodes provided in the support portion and connected to the plurality of first electrodes, respectively, using solder,
• the support portion of the rising substrate being inserted into the slit in the main substrate,
• in a direction in which the plurality of first electrodes are aligned, a width of each of the plurality of first electrodes being larger than a width of each of the plurality of second electrodes, the width of each of the plurality of second electrodes being arranged to fit within the width of each of the plurality of first electrodes,
• a pitch P between the plurality of first electrodes and between the plurality of second electrodes,
• one larger width Mw and another smaller width Sw of each of the plurality of first electrodes and each of the plurality of second electrodes, and
• a value D obtained by subtracting a length of the support portion from a length of the slit in a direction in which the slit extends
• have a relation P/2>(Mw−Sw)/2≥D.