Solid-state imaging device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYohei Ito, Yasushi Itabashi
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Abstract
According to one embodiment, a solid-state imaging device includes a substrate, a light receiving pixel, a first interconnection layer, a light shielding layer, and a first metal film. The substrate includes a sensor region and a circuit region. The light receiving pixel is provided on a surface of the sensor region of the substrate. The first interconnection layer is provided in the sensor region. The light shielding layer is provided in the sensor region and has a larger width than the first interconnection. The first metal film is provided on at least one of an upper surface or a lower surface of the light shielding layer. The first metal film partially covers at least one of the upper surface or the lower surface.
Claims13
A solid-state imaging device, comprising:
- a substrate including a sensor region and a circuit region;
- a light receiving pixel provided on a surface of the sensor region of the substrate;
- a first interconnection layer provided in the sensor region;
- a light shielding layer provided in the sensor region and having a larger width than the first interconnection;
- a first metal film provided on at least one of an upper surface or a lower surface of the light shielding layer, the first metal film partially covering at least one of the upper surface or the lower surface;
- a second interconnection layer provided in the circuit region;
- and
- a second metal film provided on at least one of an upper surface or a lower surface of the second interconnection layer.
A solid-state imaging device, comprising:
- a substrate including a sensor region and a circuit region;
- a light receiving pixel provided on a surface of the sensor region of the substrate;
- a first interconnection layer provided in the sensor region;
- a light shielding layer provided in the sensor region and having a larger width than the first interconnection;
- a first metal film provided on at least one of an upper surface or a lower surface of the light shielding layer, the first metal film partially covering at least one of the upper surface or the lower surface;
- and
- a third metal film covering all of an upper surface and a lower surface of the first interconnection layer.
Dependencies are inferred from the claim text.