Miniature image pickup module and manufacturing method thereof

A manufacturing method of a miniature image pickup module, the manufacturing method comprising steps of:

• (a) providing a substrate, wherein two vertical conductor lines are formed on a surface of the substrate;
• (b) providing a photosensitive element, wherein the photosensitive element comprises a top surface, a bottom surface, two openings and two bonding pads, wherein the two openings run through the top surface and the bottom surface, the two bonding pads are installed on the top surface, the photosensitive element is fixed on the substrate, the two vertical conductor lines are penetrated through the corresponding openings, and first ends of the vertical conductor lines are located away from the substrate and partially exposed to the top surface;
• (c) allowing the first ends of the vertical conductor lines to be electrically connected with the corresponding bonding pads;
• and
• (d) fixing a lens module on the substrate to cover a top side of the photosensitive element, so that the miniature image pickup module is manufactured.