Light-emitting diode package structure and method for manufacturing the same

A method of producing the LED package structure, comprising,

• (a) providing a substrate;
• (b) electrically connecting a gallium nitride-based semiconductor onto the substrate, in which the gallium nitride-based semiconductor is configured to emit a light having a wavelength that is shorter than 395 nm;
• (c) overlaying the gallium nitride-based semiconductor with a slurry comprising a resin, a plurality of composite fluorescent gold nanoclusters, and a plurality of luminescent carbon nanoparticles dispersed in the resin and respectively emitting a light of a wavelength ranging from 400 nm to 500 nm;
• and
• (d) curing the slurry overlaid on the gallium nitride-based semiconductor for a sufficient time to form a solidified polymeric layer, wherein the plurality of composite fluorescent gold nanoclusters are dispersed in the resin,
• wherein each composite fluorescent gold nanocluster comprises,
• a gold nanocluster;
• and
• a capping layer composed of a matrix made of a benzene-based compound, and a plurality of phosphine-based compounds distributed across the matrix,
• wherein the capping layer encapsulates at least a portion of an outer surface of the gold nanocluster.