Laminate, integrated molding, and method of producing same
AssigneeToray Industries, Inc.
InventorsTakashi Fujioka, Masato Honma
Life of this patent
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Abstract
A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180° C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.
Claims17
A laminate comprising a porous substrate (C) comprising a thermoplastic resin (c), a reinforcement fiber (A), and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), a reinforcement fiber (A), and a thermoplastic resin (D), wherein
- the porous substrate (C) has continuous gaps in a thickness direction of the laminate and a melting point or a softening point higher than 180° C., and
- the porous substrate (C) comprising the thermoplastic resin (c) is exposed on one surface of the laminate at a degree of at least 10% in relation to the surface.
A method of producing a laminate wherein a preform prepared by depositing a porous substrate (C) comprising a thermoplastic resin (c) on the surface layer of a substrate (p) comprising a reinforcement fiber (A) and a thermosetting resin (B) is molded by applying heat and pressure, wherein
- the thermosetting resin (B) is impregnated in the porous substrate (C) and cured under the temperature condition not exceeding the melting point and softening point of the porous substrate (C) to mold the preform.
An integrated molded article of a laminate with an additional member, wherein
- the laminate comprises a porous substrate (C) comprising a thermoplastic resin (c), a reinforcement fiber (A), and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), a reinforcement fiber (A), and a thermoplastic resin (D),
- the porous substrate (C) and the thermosetting resin (B) or thermoplastic resin (D) forms a co-continuous structure in a surface layer of the laminate to which additional member is integrated, and
- the thermoplastic resin (c) is exposed on one surface of the laminate to which the additional member is integrated at a degree of at least 10% in relationship to the surface, and either one of (i) or (ii) is satisfied
- (i) thermal expansion coefficient Eb of the thermosetting resin (B)<thermal expansion coefficient Ec of the porous substrate (C) or
- (ii) thermal expansion coefficient Ed of the thermoplastic resin (D)<thermal expansion coefficient Ec of the porous substrate (C).
Dependencies are inferred from the claim text.