Method for processing laminated material
AssigneeMitsui High-Tec, Inc.
InventorsAkihiro Hashimoto, Tadashi Iida, Masahiro Izumi
Life of this patent
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Abstract
At least one caulking group (13) that includes a plurality of caulking parts (14, 15) with different directions is formed on a plurality of thin plates (10) placed in a stacked state to fix the position of the stacked thin plates (10), and then a preset punching process is performed with respect to the thin plates (10) that have been positioned with pilot holes (12). This makes it possible to perform a high-accuracy punching process when punching the plurality of thin plates (10) placed in a stacked state, since positional deviations between the thin plates (10) are avoided and pilot pins (11) are prevented from deforming the periphery of the pilot holes (12).
Claims12
A method for processing a laminated material comprising:
- fixing a position of a plurality of thin plates placed in a stacked state by forming at least one caulking group having a plurality of caulking parts with different directions in planar view on the stacked thin plates;
- and
- performing a preset punching process with respect to the thin plates positioned with pilot holes after fixing the position of the thin plates.
Dependencies are inferred from the claim text.