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US 10,750,647 B2Granted
Reducing displacement of selected components during printed circuit board assembly (PCBA) manufacturing
AssigneeDell Products L.P.
InventorsSalvador D. Jimenez, Wallace H. Ables, Aaron Donald Vowell
Life of this patent
Estimating the term…
Abstract
Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.
Claims16
A Printed Circuit Board Assembly (PCBA) manufacturing tool, comprising:
- a bar having a first end and a second end, wherein the first end of the bar is configured to be coupled to a first portion of a wave solder or reflow fixture, and wherein the second end of the bar is configured to be coupled to a second portion of the wave solder or reflow fixture;
- a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a Printed Circuit Board (PCB);
- and
- a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.
1 more element
A wave solder or reflow fixture, comprising:
- a frame;
- and
- a bar coupled to the frame, the bar comprising:
- a first end;
- a movable pin coupled to the first end and configured to be inserted into a first hole of a Printed Circuit Board (PCB);
- a second end;
- and
- a fixed pin coupled to the second end and configured to be inserted into a second hole of the PCB, wherein the bar has a same Coefficient of Thermal Expansion (CTE) as the PCB.
5 more elements
Dependencies are inferred from the claim text.