Thermally removable fill materials for anti-stiction applications

A method for preventing collapse of semiconductor substrate features, comprising the steps of:

• providing a patterned semiconductor substrate having a plurality of high aspect ratio features with spaces between the features, the spaces at least partially filled with a wash solution;
• displacing the wash solution with a displacement solution including at least one primary solvent and at least one fill material, the at least one fill material having a thermal degradation temperature;
• exposing the substrate to a first elevated temperature below the thermal degradation temperature of the fill material to substantially remove the solvent from the spaces and deposit the fill material in substantially solid form within the spaces;
• and
• exposing the substrate to a second elevated temperature at or above the thermal degradation temperature of the fill material to thermally degrade and remove the fill material from the spaces;
• wherein the at least one fill material comprises at least one polyalkene carbonate (PAC) polymer present in a total amount of between 5 wt. % and 15 wt. % based on an overall weight of the displacement solution.