Film forming apparatus
AssigneeNuFlare Technology, Inc.
InventorsKunihiko Suzuki, Naohisa Ikeya, Masayoshi Yajima, Kazukuni Hara, Hiroaki Fujibayashi, Hideki Matsuura, Katsumi Suzuki
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Abstract
A film forming apparatus according to an embodiment includes: a film forming chamber configured to house therein a substrate to perform film forming processing; a gas supplier located in an upper part of the film forming chamber and configured to supply a process gas onto the substrate; and a heater configured to heat the substrate, wherein the film forming chamber has a temperature-increase suppression region being a lower part of the gas supplier and suppressing a temperature increase of the gas supplied to an upper part of the heater.
Claims16
A film forming apparatus comprising:
- a film forming chamber configured to house therein a substrate to perform film forming processing;
- a gas supplier located in an upper part of the film forming chamber and including a nozzle supplying a process gas onto the substrate;
- and
- a heater including an upper heater provided on a side wall of the film forming chamber above the substrate, the heater being configured to heat the substrate, wherein
- the film forming chamber has a temperature-increase suppression region being a lower part of the gas supplier and suppressing a temperature increase of the gas supplied to an upper part of the heater,
- the temperature-increase suppression region is located below the nozzle,
- the heater is located below the temperature-increase suppression region,
- the film forming apparatus further comprises a cooler located on a first sidewall part of the film forming chamber around the temperature-increase suppression region, and configured to suppress a temperature increase of the gas in the temperature-increase suppression region using a refrigerant, and
- the cooler and the upper heater are separated vertically.
Dependencies are inferred from the claim text.