Inorganic graded barrier film and methods for their manufacture
AssigneeAgency for Science, Technology and Research
InventorsSenthil Kumar Ramadas, Zin Ma Shwe
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Abstract
The present invention refers to a graded barrier film comprising a layered structure, wherein the layered structure comprises a first layer consisting of metal oxide; an intermediate layer consisting of metal nitride or metal oxynitride which is arranged on the first layer; and a third layer consisting of a metal oxide which is arranged on the intermediate layer. The present invention further refers to a sputtering method for manufacturing this graded barrier film and a device encapsulated with this graded barrier film.
Claims19
A graded barrier film comprising a layered structure, wherein said layered structure comprises:
- a first layer comprising a metal oxide or metal nitride;
- a second intermediate layer comprising alternating layers of a metal nitride and metal oxynitride or alternating layers of a metal oxide and metal oxynitride which is arranged on said first layer;
- and
- a third layer comprising a metal oxide or metal nitride, which is arranged on said second intermediate layer;
- wherein the first layer and the third layer has a thickness up to 60 nm;
- wherein the metal oxide, metal nitride and metal oxynitride comprise a metal which is reactive towards moisture and/or oxygen;
- wherein the vapor permeation rate of the graded barrier film is 10−2 g/m2/day or less at 60° C. and 90% relative humidity;
- and
- wherein the metal of the metal oxide, metal nitride and metal oxynitride is the same.
Dependencies are inferred from the claim text.