Dual-layer bumper for a case for a mobile device
AssigneeSamsonite IP Holdings S.a.r.l.
InventorsBryan Lee Hynecek, Randy Yang Chiang, Jon Dukershein, Darrick Del Moral, David Willson, Alan Ng
Life of this patent
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AssigneeSamsonite IP Holdings S.a.r.l.
InventorsBryan Lee Hynecek, Randy Yang Chiang, Jon Dukershein, Darrick Del Moral, David Willson, Alan Ng
Estimating the term…
A bumper (1) for a mobile device that includes a first layer (18) formed from an elastomeric first material and a second layer (2) formed from a second material different from the elastomeric first material. The first layer (18) is arranged on an outside of the bumper and the second layer (2) is arranged on an inside of the bumper so that the second layer (2) is between the mobile device and the first layer (18) when the mobile device is arranged in the bumper (1). The bumper (1) completely covers the mobile device, except for at least a portion of the front, at least a portion of the rear, and at least one speaker of the mobile device if present, when the mobile device is arranged in the bumper (1).
A case assembly for a mobile device, comprising:
A case assembly for a mobile device, comprising:
Dependencies are inferred from the claim text.