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US 10,743,376 B2Granted
High power switching devices for inductive heating applications
AssigneeAtse, LLC
InventorsFranklin B. Jones, Eric D. Donahue, Andrew I. Nehring, Daniel T. Jones, Robert A. Hummel
Life of this patent
Estimating the term…
Abstract
A closed-loop cooling system is internal to the enclosure of an induction drive system. Two inverter modules of the induction drive system each includes three insulated gate bipolar transistor (IGBT) modules for producing an AC output from a DC source, the AC output received by an induction coil for heating a metal.
Claims11
An induction drive system, comprising:
- an enclosure;
- a plurality of electronic components internal to the enclosure;
- and
- a closed-loop cooling system including a heat dissipating component internal to the enclosure and coexisting with the plurality of electronic components inside the enclosure to cool the plurality of electronic components, wherein at least one of the plurality of electronic components is directly coupled to the heat dissipating component of the cooling system, the electronic components including first and second inverter modules arranged in parallel to each other to further reduce a source of heat generated in the enclosure, the first and second inverter modules between a coolant tank and a radiator of the cooling system to remove the source of heat generated by the electronic components in the enclosure.
1 more element
A tankless closed-loop cooling system for an electronic assembly of an induction system comprising a plurality of insulated gate bipolar transistor (IGBT) power modules and rectifier modules, comprising:
- an enclosure that houses the electronic assembly of the induction system;
- at least one inverter coldplate that coexists with the electronic assembly in the enclosure and that receives a source of heat from the (IGBT) power modules;
- at least one rectifier coldplate that coexists with the electronic assembly in the enclosure and that receives a source of heat from the rectifier modules;
- a manifold block in the enclosure that is in thermal communication with the at least one inverter coldplate and the at least one rectifier coldplate;
- and
- a coolant pump that coexists with the electronic assembly in the enclosure and that provides a source of cooling fluid via the manifold block to the at least one inverter coldplate and the at least one rectifier coldplate.
3 more elements
Dependencies are inferred from the claim text.