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US 10,741,644 B2Granted
Semiconductor devices with via structure and package structures comprising the same
AssigneeDelta Electronics, Inc.
InventorsShiau-Shi Lin, Tzu-Hsuan Cheng, Hsin-Chang Tsai
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Abstract
A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.
Claims26
A semiconductor device, comprising:
- a substrate;
- an active layer disposed on the substrate;
- a via through the active layer;
- and
- a source electrode, a drain electrode and a gate electrode in contact with the active layer and the via is completely filled with the source electrode.
2 more elements
A package structure, comprising:
- a conductive structure;
- a semiconductor device connected to the conductive structure, wherein the semiconductor device comprises a substrate having a first side and a second side, an active layer disposed on the first side of the substrate, a via through the active layer and a plurality of electrodes disposed on the active layer and one of the plurality of electrodes into the via;
- and
- an encapsulation material covering the semiconductor device and a part of the conductive structure, exposing the second side of the substrate and a part of the conductive structure.
1 more element
A package structure, comprising:
- a semiconductor device comprising a substrate, an active layer, a via, and an electrode, wherein the active layer is disposed between the substrate and the electrode, and the active layer comprises the via electrically connected with the electrode and the substrate, and the via through the active layer;
- a conductive structure disposed on the electrode;
- and
- an encapsulation material surrounding the semiconductor device and the conductive structure, wherein a part of the semiconductor device and a part of the conductive structure are exposed from the encapsulation material.
1 more element
Dependencies are inferred from the claim text.