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US 10,741,474 B2Granted
Component module and power module
AssigneeSiemens Aktiengesellschaft
InventorStefan Stegmeier
Life of this patent
Estimating the term…
Abstract
The disclosed component module includes a component comprising at least one electric contact to which at least one porous contact piece is connected; the component module further includes a cooling system for fluid-based cooling, said cooling system comprising one or more cooling ducts which are formed by pores of the porous contact piece. The disclosed power module comprises a component module of said type.
Claims17
A component module comprising:
- a heat generating power component directly connected to at least one electrical contact, the at least one electrical contact being an electrically conductive film-like layer, in which a first surface of an open-pore electrical contact piece is connected to the at least one electrical contact and a second surface of the open-pore electrical contact piece opposite the first surface is connected to a substrate, such that there are no heat generating devices disposed between the second surface of the open-pore electrical contact piece and the substrate, wherein the open-pore electrical contact piece is formed by a fabric-like structure, a foam-like structure, a mesh-like structure, stacked leadframes, or any combination thereof;
- and
- a cooling system for cooling using a cooling fluid, the cooling system comprising one or more cooling ducts that are formed by pores of the open-pore electrical contact piece.
A power module comprising:
- a component module comprising:
- a heat generating power component directly connected to at least one electrical contact, the at least one electrical contact being an electrically conductive film-like layer, in which a first surface of an open-pore electrical contact piece is connected to the at least one electrical contact and a second surface of the open-pore electrical contact piece opposite the first surface is connected to a substrate, such that there are no heat generating devices disposed between the second surface of the open-pore electrical contact piece and the substrate, wherein the open-pore electrical contact piece is formed by a fabric-like structure, a foam-like structure, a mesh-like structure, stacked leadframes, or any combination thereof;
- and
- a cooling system for cooling using a cooling fluid, the cooling system comprising one or more cooling ducts that are formed by pores of the open-pore electrical contact piece.
1 more element
Dependencies are inferred from the claim text.