Image capturing module and manufacturing method thereof

An image capturing module comprising:

• a lighting emitting element;
• a sensing element;
• a first circuit substrate, comprising a first substrate, the first substrate having a first through hole and a second through hole, wherein the light emitting element is disposed in the first through hole, and the sensing element is disposed in the second through hole;
• a second circuit substrate, disposed on one side of the first circuit substrate and comprising a second substrate, the second substrate having a third through hole and a fourth through hole, wherein the third through hole overlaps the first through hole and exposes a light emitting surface of the light emitting element disposed in the first through hole, the fourth through hole overlaps the second through hole and exposes a sensing surface of the sensing element disposed in the second through hole;
• and
• a third circuit substrate, disposed on another side of the first circuit substrate, and the first circuit substrate is located between the second circuit substrate and the third circuit substrate, wherein the light emitting element is mounted on the third circuit substrate and electrically connected to the third circuit substrate;
• wherein the first circuit substrate further comprises a first conductive pillar penetrating the first substrate, the second circuit substrate further comprises a first circuit layer, the first circuit layer is disposed on the second substrate and located between the second substrate and the first substrate, the first circuit layer is electrically connected to the sensing element and the first conductive pillar, the third circuit substrate comprises a third substrate, a plurality of second conductive pillars penetrating the third substrate, a second circuit layer and a third circuit layer, the second circuit layer and the third circuit layer are respectively disposed on opposite surfaces of the third substrate, wherein the second circuit layer is located between the third substrate and the first circuit substrate and electrically connected to the light emitting element, the first conductive pillar and the second conductive pillars, and the third circuit layer is electrically connected to the second conductive pillars.