US 10,734,268 B1 · Modularity of Tec-Cell, FOUP and substrate containers and carriers

Abstract

Methods, systems and apparatuses for an improved wafer and substrate carrier or container with improved modularity. More specifically, to a carrier or container with improved abilities which may provide high or low density carriers or containers with improved interchanging and compatibility, including for Tec-Cells, FOUPs, and other third party containers, carriers, modules, rings or any other systems, structures, apparatuses, or methods associated. The invention may provided an ability to interchange or be cross-compatible such as wherein Tec-Cell carriers, containers, rings or modules may be provided to be housed in a FOUP or other third party carrier or wherein substrates or wafers held in the Tec-Cell Carriers, rings, containers, or modules, and then held within the FOUP.

Claims19

Dependent claims

A substrate manufacturing, storage, processing, or transfer system, comprising:

a loading sub-system including a load port, wherein
the load port transfers one or more elements to and from one or more exterior systems and one or more interior sub-systems, wherein
the load port partially or completely isolates an interior of the system from an ambient environment;
the one or more elements are one or more holders that hold one or more substrates;
the load port is configured to accept any of Tec-Cell substrates, third party substrates, the one or more holders, and one or more containers without the load port being reconfigured;
the load port includes a robot;
and
the robot readies the one or more holders and at least one of the one or more substrates to be accessed in batches or groups.

5 more elements

Dependencies are inferred from the claim text.

Modularity of Tec-Cell, FOUP and substrate containers and carriers

Life of this patent

Modularity of Tec-Cell, FOUP and substrate containers and carriers

Life of this patent

Abstract

Claims19