Treatment head, treatment system and method for treating a local surface area of a substrate

A method of treating a local surface area of a substrate to be treated, the method comprising:

• placing a treatment head having a main surface adjacent to and facing the local surface area of the substrate to be treated, such that a substantially uniform gap is formed between the surface and the local surface area to be treated;
• providing a scanning movement along a scan direction between the treatment head and the substrate to be treated while maintaining the gap;
• treating the local surface area during the movement along the scan direction by sequentially exposing the local surface area to the following in the gap:
• a gas flow into an exhaust opening provided in the main surface of the treatment head, the gas flow causing a suction force on the local surface area to be treated;
• radiative heat emitted from a radiation opening provided in the main surface of the treatment head towards the substrate to be treated, the radiative heat causing local heating of the local surface area to be treated;
• a plasma jet emitted from a plasma exit opening provided in the main surface of the treatment head towards the local surface area to be treated;
• and
• a purge gas flow provided from an outlet opening provided in the main surface of the treatment head into the gap.