System for performing work on substrate and insertion method

An insertion method for inserting a pair of leads of a leaded component into a pair of insertion holes via a pair of through-holes in a board work system, the board work system including

• a holding device configured to hold a board, the board being formed with a through-hole into which a lead of a leaded component is to be inserted;
• a mounting head configured to hold the leaded component and to insert each of the pair of leads of the held leaded component into the through-holes of the board held by the holding device;
• a bending device configured to bend a lead inserted into the insertion hole, the bending device including (A) a pair of moving bodies each including an insertion hole into which a lead is inserted via the through-hole, (B) a holding body configured to hold the pair of moving bodies such that the moving bodies can be moved towards and away from each other, and (C) a drive source that changes an insertion hole spacing distance that is a distance between the insertion holes to a given distance by moving the pair of moving bodies towards and away from each other;
• and
• an imaging device configured to image the leaded component held by the mounting head, the insertion method comprising:
• imaging the leaded component held by the mounting head;
• acquiring a lead spacing distance that is a distance between the pair of leads of the leaded component based on imaging data obtained by the imaging;
• controlling operation of the drive source based on the acquired lead spacing distance;
• and
• inserting the pair of leads of the leaded component held by the mounting head into the pair of insertion holes via the pair of through-holes.