Electronic module having circuit boards and a plastic sealing ring that can be molded on by injection molding, in particular for a motor vehicle transmission control unit, and method for producing said electronic module

A method for producing an electronic module, comprising:

• providing a first circuit board element, a second circuit board element beneath the first circuit board element, and a spacer, the first circuit board element, the second circuit board element, and the spacer configured such that together they fully enclose a central cavity in which at least one electronic component of the first circuit board element is received;
• forming a first microstructuring in a shape of a first ring on an upwardly directed surface of the first circuit board element without microstructuring entire upwardly directed surface of the first circuit board element, forming a second microstructuring in a shape of a second ring on an outer circumference of the first circuit board element, and forming a third microstructuring in a shape of a third ring located outside of the cavity next to the spacer on an upwardly directed surface of the second circuit board element without microstructuring entire upwardly directed surface of the second circuit board element outside of the cavity;
• arranging the at least one electronic component on a surface of the first circuit board element facing toward the central cavity;
• and
• forming a sealing ring along the outer circumference of the first circuit board element such that the sealing ring is connected with a form fit to the first microstructuring and the second microstructuring formed on the first circuit board element and is connected with a form fit to the third microstructuring formed on the second circuit board element.