Substrate support with thermal zones for semiconductor processing
AssigneeLam Research Corporation
InventorsHarmeet Singh, Keith Gaff, Neil Benjamin, Keith Comendant
Life of this patent
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Abstract
A substrate support in a semiconductor plasma processing apparatus, comprises multiple independently controllable thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the thermal zones. A substrate support in which the substrate support is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the substrate support include bonding together ceramic or polymer sheets having thermal zones, power supply lines, power return lines and vias.
Claims25
A electrostatic chuck configured to support a semiconductor substrate in a semiconductor processing apparatus, the electrostatic chuck comprising:
- a plurality of thermal zones implemented in the electrostatic chuck;
- power supply lines comprising a first electrically conductive power supply line electrically connected to at least two of the plurality of thermal zones and a second electrically conductive power supply line electrically connected to at least two of the plurality of thermal zones, wherein the at least two of the plurality of thermal zones connected to the second electrically conductive power supply line are different than the at least two of the plurality of thermal zones connected to the first electrically conductive power supply line;
- and
- power return lines comprising a first electrically conductive power return line electrically connected to at least two of the plurality of thermal zones and a second electrically conductive power return line electrically connected to at least two of the plurality of thermal zones, wherein the at least two of the plurality of thermal zones connected to the second electrically conductive power return line are different than the at least two of the plurality of thermal zones connected to the first electrically conductive power return line, and
- wherein
- each of the plurality of thermal zones is connected to a different pair of the power supply lines and the power return lines, and
- each of the different pairs includes one of the power supply lines and one of the power return lines.
Dependencies are inferred from the claim text.