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US 10,716,217 B2Granted
Poly-based burr suppressor
AssigneeAdvanced Copper Foil Inc.
InventorShane Hugh Stewart
Life of this patent
Estimating the term…
Abstract
A burr-suppressing copper foils are described. In an embodiment, the burr suppressing copper foil includes a poly-based film having an adhesive on a first side and an adhesive on a second side. A copper foil contacts the adhesive at the first side of the poly-based film to removably couple the poly-based film to the copper foil. A metallic burr suppressor contacts the adhesive on the second side to removably couple the poly-based film to the metallic burr suppressor.
Claims15
A method for manufacturing a printed circuit board (PCB), the method comprising:
- constructing a book having a burr-suppressing copper foil on at least one exterior side of the book, the burr-suppressing copper foil comprising a poly-based film having an adhesive applied at opposing sides, a copper foil directly contacting and coupled to the poly-based film with the adhesive on a first side of the poly-based film, the copper foil adjacent to and in contact with a pre-impregnated layer, and a metallic burr suppressor coupled to the poly-based film with the adhesive on a second side of the poly-based film, the metallic burr suppressor being an outer layer of the book;
- applying a lamination cycle to the book using a laminating press to cure the pre-impregnated layer of the book and form a laminated book;
- after the lamination cycle, drilling the laminated book;
- and
- removing the poly-based film and the metallic burr suppressor from the drilled and laminated book.
2 more elements
Dependencies are inferred from the claim text.