Multi-layered substrate manufacturing method
AssigneeNikon Corporation
InventorsHidehiro Maeda, Satoshi Katagiri
Life of this patent
Estimating the term…
Abstract
Provided is a substrate holding unit that holds a pair of substrates that are aligned and layered, comprising a first holding member that holds one of the substrates; a plurality of members to be joined that are connected to the first holding member; a second holding member that holds the other of the substrates to face the one of the substrates; a plurality of joining members that exert an adhesion force on the members to be joined and are connected to the second holding member at positions corresponding to positions of the members to be joined; and an adhesion restricting section that restricts the adhesion force until the substrates are aligned.
Claims16
A substrate bonding method for aligning and layering a pair of substrates, comprising:
- holding one of the pair of substrates with a first holding member that has a member to be joined;
- holding the other of the pair of substrates to face the one of the substrates with a second holding member that has a joining member exerting a joining force on the member to be joined;
- aligning the pair of substrates;
- layering the pair of substrates, such that the aligned pair of substrates make direct contact and are held in a layered state between the first holding member and the second holding member;
- using the joining force to make contact between the member to be joined and the joining member in order to join the member to be joined and the joining member, the contact between the member to be joined and the joining member being made after the layering of the pair substrates;
- and
- restricting a magnitude of the joining force during at least one of the aligning and the layering of the pair of substrates, such that the joining force applied to the member to be joined and the joining member is reduced.
Dependencies are inferred from the claim text.