Composite and multilayered silver films for joining electrical and mechanical components
AssigneeAlpha Assembly Solutions Inc.
InventorsOscar Khaselev, Bin Mo, Monnir Boureghda, Michael T. Marczi, Bawa Singh
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Abstract
Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
Claims16
A silver film, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles wherein each layer of sinterable particles comprises a mixture of sinterable silver particles and graphite particles, wherein the multilayer structure does not exhibit degradation after 500 thermal shock cycles between −40° C. and 125° C., wherein the silver film is configured for die attachment by application of heat and pressure to sinter the silver film.
Dependencies are inferred from the claim text.