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US 10,709,047 B2Granted
Component mounting device head unit
AssigneeFuji Corporation
InventorsKoji Kawaguchi, Junichi Narita
Life of this patent
Estimating the term…
Abstract
A component mounting device head unit includes a head main body, a nozzle being provided on the head main body, a drive source, a cover, and a heat transfer member. The nozzle is configured to pick up a component. The drive source is configured to transfer moving power to at least one of the head main body and the nozzle. The cover covers the drive source. The heat transfer member connects the cover to the drive source or a frame of the drive source, and the heat transfer member is configured to allow heat generated by the drive source to escape to the cover.
Claims4
A component mounting device head unit comprising:
- a head main body;
- a nozzle configured to pick up a component, the nozzle being provided on the head main body;
- a drive source configured to transfer moving power to at least one of the head main body and the nozzle;
- a cover covering the drive source;
- a heat transfer member connecting the cover to the drive source or a frame of the drive source, the heat transfer member being configured to allow heat generated by the drive source to escape to the cover;
- and
- a camera configured to image a component held by the nozzle, the camera being provided at a location covered by the cover,
- wherein the heat transfer member connects a surface of the cover except for a surface facing the camera to the drive source or the frame of the drive source.
5 more elements
Dependencies are inferred from the claim text.