Electronic device comprising interposer surrounding circuit elements disposed on printed circuit board

An electronic device comprising:

• a housing:
• a first substrate disposed within the housing and including a first signal line and a first ground;
• a second substrate disposed on the first substrate and including a second signal line and a second ground;
• and
• a shielding member comprising an electrical shield surrounding at least a portion of the first substrate and at least a portion of the second substrate to define a shielding space including the at least a portion of the first substrate and the at least a portion of the second substrate,
• wherein the shielding member includes:
• a first surface connected to the first substrate;
• a second surface connected to the second substrate;
• an inner side surface connecting the first surface and the second surface and facing an inner side of the shielding space;
• an outer side surface connecting the first surface and the second surface and facing an outer side of the shielding space;
• and
• conductive vias penetrating the first surface and the second surface and disposed along a circumference of the shielding member,
• wherein the conductive vias include a plurality of first conductive vias electrically connected with the first signal line and the second signal line, and a plurality of second conductive vias electrically connected with the first ground and the second ground,
• wherein one of the inner side surface and the outer side surface of the shielding member includes a conductive region electrically connected with the first ground and/or the second ground, and a non-conductive region arranged in the conductive region,
• wherein the other of the inner side surface and the outer side surface of the shielding member includes a corresponding conductive region facing the non-conductive region, and
• wherein the corresponding conductive region further extends to opposite sides of a circumference direction of the shielding member.

An interposer comprising:

• a substrate having an inner surface and an outer surface facing away from the inner surface;
• and
• a plurality of through holes formed in the substrate,
• wherein the outer surface includes a first conductive region electrically connected with at least one first through hole of the plurality of through holes, and a non-conductive region,
• wherein the inner surface includes a second conductive region electrically connected with at least one second through hole of the plurality of through holes, and
• wherein the second conductive region includes a region facing the non-conductive region.