Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsGerald Weidinger, Timo Schwarz, Andreas Zluc
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Abstract
A method of manufacturing a circuit board or a circuit board intermediate product, wherein the method comprises providing a carrier structure, applying a layer of flowable low-viscosity adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, and pressing the electronic component into a subsection of the layer of adhesive in the mounting area so that at least part of the electronic component is immersed within the adhesive.
Claims18
A method of manufacturing a circuit board intermediate product, wherein the method comprises:
- providing a carrier structure;
- applying a layer of flowable adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, wherein the mounting area equals to a lower main surface of the electronic component;
- pressing the electronic component into a subsection of the layer of adhesive in the mounting area thereby immersing at least part of the electronic component within the adhesive;
- and
- removing the carrier structure after solidifying the adhesive.
A method of manufacturing a circuit board, comprising:
- providing a carrier structure;
- applying a layer of flowable adhesive on the carrier structure over a surface area of the carrier structure which is larger than a mounting area in which an electronic component is to be mounted on the carrier structure, wherein the mounting area equals to a lower main surface of the electronic component;
- pressing the electronic component into a subsection of the layer of adhesive in the mounting area thereby immersing at least part of the electronic component within the adhesive;
- and
- removing the carrier structure after solidifying the adhesive.
Dependencies are inferred from the claim text.