System-in-package including opposing circuit boards
AssigneeApple Inc.
InventorsYanfeng Chen, Shankar Pennathur, Mandar Painaik, Lan Hoang, Meng Chi Lee
Life of this patent
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Abstract
System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
Claims21
A system-in-package comprising:
- a first circuit board having a first side and a second side opposite the first side;
- one or more second side components mounted on at least the second side of the first circuit board;
- a second circuit board having a first side and a second side opposite the first side, wherein the first side of the second circuit board faces the second side of the first circuit board, and wherein one or more first side components are mounted on at least the first side of the second circuit board;
- and
- a plurality of interposers extending between and electrically connecting the first circuit board to the second circuit board, wherein the plurality of interposers includes a first group of interposers dispersed between the first circuit board and the second circuit board, and a second group of interposers that laterally surrounds a subsystem of the one or more second side components or the one or more first side components to provide electromechanical interference (EMI) shielding for the subsystem.
A system-in-package formed by a method of assembly, comprising:
- stacking a first circuit board on a second circuit board to form a circuit board stack, wherein the first circuit board includes one or more bottom side components mounted and a first plurality of interposers on a bottom side of the first circuit board, and the second circuit board comprises one or more top side components and a second plurality of interposers mounted on a top side of the second circuit board;
- wherein stacking the first circuit board on the second circuit board comprises bonding the first plurality of interposers to the second plurality of interposers such that the first circuit board is electrically connected to the second circuit board with the bonded first and second pluralities of interposers;
- wherein the first and second pluralities of interposers includes a first group of interposers dispersed between the first circuit board and the second circuit board, and a second group of interposers that laterally surrounds a subsystem of the one or more bottom side components or the one or more top side components to provide electromechanical interference (EMI) shielding for the subsystem;
- placing the circuit board stack onto a carrier substrate;
- and
- singulating the circuit board stack.
Dependencies are inferred from the claim text.