Power module assembly structure

A power module assembly structure comprising:

• an element layer including at least one component, the at least one component including a plurality of terminals;
• a flexible printed circuit board layer including at least one insulating region and at least one conductive region, wherein the at least one conductive region is disposed corresponding to the at least one component, and one of the terminals of the at least one component is electrically connected to the at least one conductive region, the element layer is disposed on a first side of the flexible layer;
• and
• an external wire layer disposed on a second side of the flexible printed circuit board layer, the first side and the second side of the flexible printed circuit board layer being two opposite sides, and the external wire layer including at least one external wire, the at least one external wire being electrically connected to the at least one conductive region of the flexible printed circuit board layer, the flexible printed circuit board layer being disposed between the element layer and the external wire layer, the at least one conductive region is a double-sided window conductive region of the flexible printed circuit board layer opened on both sides as areas electrically connected to the element layer and the external wire layer;
• wherein the heat generated by the at least one component is directly conducted to the outside of the power module package structure through the at least one conductive region and the at least one external wire.