Optical transceiver and housing thereof
AssigneePrime World International Holdings Ltd.
InventorsMing-You Lai, Chien-Te Lin, Ming-Hsing Chung
Life of this patent
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Abstract
An optical transceiver includes a housing and an optical transceiving module. The housing includes a main body and a heat conductive component. The heat conductive component is disposed on the main body, and a thermal conductivity of the heat conductive component is larger than a thermal conductivity of the main body. The optical transceiving module is disposed in an accommodation space of the main body of the housing.
Claims20
An optical transceiver, comprising:
- a housing comprising a main body and a heat conductive component, the heat conductive component defining an outer surface of the main body, and a thermal conductivity of the heat conductive component being larger than a thermal conductivity of the main body;
- an optical transceiving module disposed in an accommodation space of the main body of the housing;
- and
- wherein the main body of the housing comprises first and second casings to couple to each other and form the accommodation space of the main body therebetween, the heat conductive component being disposed on the second casing, and wherein the second casing and heat conductive component disposed thereon are configured to decouple from the optical transceiving module based on the first and second casings being decoupled from each other.
A housing of an optical transceiver, comprising a main body and a heat conductive component, the main body being configured to accommodate an optical transceiving module, the heat conductive component defining an outer surface of the main body, and a thermal conductivity of the heat conductive component being larger than a thermal conductivity of the main body, wherein the main body of the housing comprises first and second casings to couple to each other and accommodate the optical transceiving module therebetween, the heat conductive component being disposed on the second casing, and wherein the second casing and heat conductive component disposed thereon are configured to decouple from the optical transceiving module based on the first and second casings being decoupled from each other.
Dependencies are inferred from the claim text.