Microwave module

A microwave module comprising:

• a plurality of microwave devices, each of the microwave devices including a microwave circuit, a device substrate, and an electromagnetic shield wall, the device substrate having the microwave circuit mounted thereon, the device substrate including a heat dissipation embedded member thermally connected to the microwave circuit and a signal through hole connected to the microwave circuit, the electromagnetic shield wall covering at least the microwave circuit;
• a plurality of multilayer resin substrates, each of the multilayer resin substrates including:
• a first end face on which the microwave devices are mounted;
• a second end face opposite to the first end face;
• a first surface ground provided on a side of the first end face and connected to a ground of the electromagnetic shield wall;
• a plurality of first signal through holes, each of the first signal through holes being connected to a signal through hole of the microwave circuit to transmit a microwave signal;
• a plurality of first ground through holes, each of the first ground through holes being provided to surround the first signal through holes and connected to the first surface ground,
• a second signal through hole connected to the first signal through holes
• a plurality of second ground through holes provided to surround the second signal through hole and connected to the first surface ground;
• a first pad connected to the second signal through hole and formed on a surface on a side of the second end face;
• ground pads arranged so as to surround the first pad and connected to the second ground through holes;
• a second surface ground provided on the side of the second end face and connected to the ground pads;
• and
• a heat dissipator thermally connected to the heat dissipation embedded member of the microwave devices and the second surface ground
• a cooling plate having the multilayer resin substrates mounted thereon, the cooling plate being thermally connected to the heat dissipator of each of the multiplayer resin substrates, the cooling plate and the second surface ground forming a space therebetween;
• a distribution circuit board having a second pad and a plurality of ground pads formed on a surface thereof facing the multilayer resin substrates, the ground pads of the distribution circuit board surrounding the second pads, the distribution circuit board being accommodated in the space of the cooling plate;
• a plurality of spring contact terminals, each of the spring contact terminals being connected to the first pad of the multilayer resin substrates and the second pad of the distribution circuit board to transmit a microwave signal to and from the multilayer resin substrates;
• and
• a plurality of spring ground contact terminals, each of the spring ground contact terminals being connected to a corresponding one of the ground pads of the multilayer resin substrates and a corresponding one of the ground pads of the distribution circuit board.