Elastic wave device and method for manufacturing the same

An elastic wave device comprising:

• a piezoelectric substrate;
• a functional electrode that is disposed on the piezoelectric substrate;
• a support layer that is disposed on the piezoelectric substrate and surrounds the functional electrode;
• and
• a cover member that is disposed on the support layer, seals an opening of the support layer, and includes a first main surface facing the support layer and a second main surface opposite to the first main surface;
• wherein
• a recess is located in the cover member and is open to the second main surface;
• a via hole extends through the support layer and to a bottom surface of the recess of the cover member, the via hole including an opening that is open to the bottom surface;
• an area of the opening of the via hole is less than an area of the bottom surface of the recess of the cover member;
• the elastic wave device further includes a via conductor;
• the via conductor includes a first via conductor portion that is provided in the via hole and a second via conductor portion that is provided in the recess of the cover member;
• a bump is bonded to an end portion of the second via conductor portion opposite to an end portion of the second via conductor portion that faces the first via conductor portion;
• the cover member includes a first cover member and a second cover member;
• the second cover member is laminated on the first cover member;
• the recess of the cover member is located in the second cover member so as not to extend to the first cover member;
• the first cover member is a resin layer that is bonded to the second cover member and the support layer;
• and
• the second cover member is a resin layer that protects the first cover member.