Piezoelectric oscillation device and manufacturing method therefor
AssigneeMurata Manufacturing Co., Ltd.
InventorsTakuya Yamazaki, Toshikatsu Ohitsu, Hiroaki Kaida
Life of this patent
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Abstract
A piezoelectric oscillation device includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, an electronic component that is electrically connected to the piezoelectric vibration element, a substrate on which the piezoelectric vibrator, the heating element, and the electronic component are mounted, and a base member to which the substrate is attached with a prescribed spacing therebetween via a substrate holding member. The substrate holding member includes a conductive part. The conductive part has a lower thermal conductivity than metal.
Claims18
A piezoelectric oscillation device comprising:
- a piezoelectric vibrator including a piezoelectric vibration element;
- a heating element that heats the piezoelectric vibration element;
- an electronic component that is electrically connected to the piezoelectric vibration element;
- a substrate on which the piezoelectric vibrator, the heating element and the electronic component are mounted;
- and
- a base member, the substrate being attached to and spaced from the base member via a substrate holding member comprising a conductive part which includes (i) a conductive resin material which has a lower thermal conductivity than metal and (ii) a covering part covering the conductive part and having a lower thermal conductivity than the conductive part.
A method of manufacturing a piezoelectric oscillation device, the method comprising:
- (a) mounting, on a substrate, a piezoelectric vibrator that includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, and an electronic component that is electrically connected to the piezoelectric vibration element;
- and
- (b) attaching the substrate to a base member with a space there between using at least one substrate holding member, at least one of the substrate holding members including a conductive part comprising a conductive resin having a lower thermal conductivity than metal and a covering part covering the conductive part and having a lower thermal conductivity than the conductive part.
A method of manufacturing a piezoelectric oscillation device, the method comprising:
- (a) mounting, on a substrate, a piezoelectric vibrator that includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, and an electronic component that is electrically connected to the piezoelectric vibration element;
- (b) forming at least one substrate holding member that is for holding the substrate on the base member, the substrate holding member including a conductive part comprising a conductive resin having a lower thermal conductivity than metal, the at least one substrate holding member being formed by, at least:
- (i) forming a conductive resin block by applying a conductive resin material in the form of a paste to a sheet and curing the conductive resin material;
- (ii) shaping the conductive resin block on the sheet;
- (iii) obtaining a plurality of the substrate holding members by dividing the conductive resin block on the sheet into individual substrate holding members;
- and
- (iv) removing each substrate holding member from the sheet;
- and
- (c) attaching the substrate to the base member with a prescribed spacing there between via the substrate holding member.
A method of manufacturing a piezoelectric oscillation device, the method comprising:
- (a) mounting, on a substrate, a piezoelectric vibrator that includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, and an electronic component that is electrically connected to the piezoelectric vibration element;
- (b) forming at least one substrate holding member that is for holding the substrate on the base member, the substrate holding member including a conductive part comprising a conductive resin having a lower thermal conductivity than metal, the at least one substrate holding member being formed by, at least:
- (i) forming a conductive resin block by applying a conductive resin material in the form of a paste to the base member and curing the conductive resin material;
- and
- (ii) shaping the conductive resin block on the base member;
- and
- (c) attaching the substrate to the base member with a prescribed spacing there between via the substrate holding member.
Dependencies are inferred from the claim text.