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US 10,707,642 B2Granted
Housing for an electronic component, and laser module
AssigneeSchott AG
InventorsRobert Hettler, Michelle Fang
Life of this patent
Estimating the term…
Abstract
A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.
Claims20
A housing for an electronic component, comprising:
- a heat sink for a thermoelectric cooler;
- a basic body having an upper end and a lower end and a mounting area for the electronic component located therebetween,
- wherein the basic body consists of a deep drawn metal part that has a lateral wall with a first feedthrough provided therein, the first feedthrough being configured to receive a light guide, and
- wherein the basic body has a base wall having the heat sink and having a plurality of second feedthroughs in the form of a glazing, the plurality of second feedthroughs being configured to receive pins electrically connecting the electronic component, wherein the base wall has a first thickness at a region of the heat sink and has a collar around each of the plurality of second feedthroughs, the base wall at a region of the collars having a second thickness that is increased as compared to the first thickness.
1 more element
A housing for an electronic component, comprising:
- a heat sink for a thermoelectric cooler;
- a basic body having an upper end and a lower end and a mounting area for the electronic component located therebetween,
- wherein the basic body is a deep drawn metallic part,
- wherein the basic body has a lateral wall with a first feedthrough provided therein, the first feedthrough being configured to receive a light guide,
- wherein the basic body has a base wall having the heat sink and having a plurality of second feedthroughs, the plurality of second feedthroughs being configured to receive pins electrically connecting the electronic component, and
- wherein the base wall has a first thickness at a region of the heat sink and has a collar around each of the plurality of second feedthroughs, the base wall at a region of the collars having a second thickness that is increased as compared to the first thickness.
3 more elements
A housing for an electronic component, comprising:
- a heat sink for a thermoelectric cooler;
- a basic body having a rectangular outer shape with an upper end, a lower end, and a lateral wall that define, in an interior, a mounting area for an electronic component, the lateral wall having a first feedthrough configured to receive a light guide, the lower end defining a base wall with the heat sink and having a plurality of second feedthroughs, the upper end having a collar extending outward all the way around a periphery thereof, wherein the basic body is a deep drawn metallic part wherein the base wall has a first thickness at a region of the heat sink and has a second collar around each of the plurality of second feedthroughs, the base wall at a region of the second collars having a second thickness that is increased as compared to the first thickness;
- and
- a cover that closes the upper end of the basic body, the cover being attached to the collar;
- and
- a circumferential ridge that secures the cover and the collar to one another on either the cover or the collar.
3 more elements
Dependencies are inferred from the claim text.